报告人：Prof. Beng Ong（王明顺）
联系人：陈克求教授
时间：2017-3-20 晚上7:30-9:00
地点：研究生新楼A201
欢迎本科生、研究生和教师参加！
报告人简介：Prof. Beng Ong（王明顺教授）目前是香港浸会大学有机电子科学卓越研究中心主任，创意学院副主任，化学系材料科学讲座教授。
Abstract
The interest in printed electronics has exploded over the last decade owing to its potential for creating novel impactful large‐area, lightweight, flexible, and low‐cost electronics. To realize this technology vision, manufacture of semiconductor devices by high‐throughput roll‐to‐roll printing, instead of slow, batch‐wise photolithographic processes, would be paramount. Printed electronics offers a low‐cost and eco‐friendlier manufacturing approach to a wide spectrum of semiconductor devices including next‐gen displays, ultra‐low‐cost RFIDs, smart labels and packaging, sensors and images, etc. Foremost among critical enablers to propel this paradigm shift in manufacturing is a performance‐fulfilling materials suite and compatible processes for fabricating unctionally‐capable transistors – the fundamental building blocks of modern microelectronics. This presentation discusses the issues, challenges, and advances in materials and process development for printed electronics over the last decade and the outlook for this emerging technology moving forward. It aims to shed light on whether this emerging technology is all fantasy and hypes or innovations and opportunities of impactful commercial values for our times and beyond.
